Redistributed Chip Packaging (RCP) technology
July 28th 2006 12:38
Processors packing technology from the common ball-grid array (BGA) to the new process developed by Freescale called Redistributed Chip Packaging (RPC). According to Freescale the new processor packing technology is going to eliminate all wire bonds and package substrates. RCP is an interconnect buildup technology in which the package is a functional part of the die. This processor packing technology will be compatible with advanced assembly technologies like System in a Package (SiP), Package on a Package (PoP) and integrated cavity packages.
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