CoukieRedistributed Chip Packaging (RCP) technology
July 28th 2006 12:38
Processors packing technology from the common ball-grid array (BGA) to the new process developed by Freescale called Redistributed Chip Packaging (RPC). According to Freescale the new processor packing technology is going to eliminate all wire bonds and package substrates. RCP is an interconnect buildup technology in which the package is a functional part of the die. This processor packing technology will be compatible with advanced assembly technologies like System in a Package (SiP), Package on a Package (PoP) and integrated cavity packages.
PDAs and cell phones normally use BGA packaging, but miniaturization requirements make them first candidates to implement RCP. RCP will allow companies to develop 30 percent smaller packaged semiconductors solutions than the actual BGA products. At this time RCP allows the development of a 25x25 millimeter radio chip.
It is expected that the first devices using processors with this technology will be in the market by 2008.
An example of the use of the technology can be found at the Freescale’s radio in package (RiP) solution.
“As I/O and interconnect density increases, the benefits of RCP rise exponentially. The only limitations on the use of RCP are I/O density and die size. This means that RCP packages can be made very small and very integrated, enabling innovations such as Freescale’s radio in package (RiP). RiP could, for example, replace the electronics in an entire cell phone with one integrated package. This could produce new form factors such as a self-contained cell phone in a headset.”
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